| 121 | Ternary-blend Halide Perovskites for Thin-Film Photonic Devices: From Photodetectors to LEDs and Lasers Internships | imec | Leuven |
| 122 | Thermal and Mechanical Co-Design of Future Chiplet Systems Using Physics-Informed Machine Learning Internships | imec | Leuven |
| 123 | Thin-Film Deposition of Prussian Blue Analogue based room temperature Magnets Internships | imec | Leuven |
| 124 | Thin-Film Ferroelectrics for Low-Loss Quantum Microwave Devices Internships | imec | Leuven |
| 125 | Thin-Film Ga₂O₃ for Next Generation Deep-UV Sensing Internships | imec | Leuven |
| 126 | Towards 4D Spatial Omics in Organ-on-Chip platforms Internships | imec | Leuven |
| 127 | Towards High-Endurance fast-erase 3D FeFETs with OSC channel Internships | imec | Leuven |
| 128 | Towards Predictive Reliability: Correlative Characterisation of Buried Interfaces in Emerging Thin-Film Materials and Devices Internships | imec | Genk |
| 129 | Ultra-Low-Loss Fiber-to-Chip Coupling for Next-Generation Photonic and Quantum Systems Internships | imec | Gent |
| 130 | Ultrafast dynamics of thin film LEDs and lasers Internships | imec | Leuven |
| 131 | Ultrafast, Multiplexed EUV Scatterometry for Device Metrology in the Ångström and Quantum Technology Eras Internships | imec | Leuven |
| 132 | Understanding High Optical Power Induced Degradation Mechanisms in Si Photonic Devices Internships | imec | Leuven |
| 133 | Understanding the surface chemistry of amorphous carbon materials to enable area-selective atomic layer deposition on complex 3D integration architectures Internships | imec | Leuven |
| 134 | Unified Acoustical Radios and Protocols Designs for Underwater Communication, localization and Sensing Internships | imec | Gent |
| 135 | Unraveling Next-gen 3D NAND Flash Through Model-Driven Experiments Internships | imec | Leuven |
| 136 | Unraveling the origins of strain variability in NS and CFET transistors through advanced TEM and EELS Internships | imec | Leuven |
| 137 | Upscaling physics simulations at system-level with AI and finite elements Internships | imec | Leuven |
| 138 | Voltage-controlled exchange coupling for next-generation low-power MRAM Internships | imec | Leuven |
| 139 | [NanoIC] Advancing Ultrasonic Inspection for Voids in Heterogeneously Integrated Semiconductor Devices Internships | imec | Leuven |
| 140 | [NanoIC] Circuit design exploration for quasi-adiabatic compute in the most advanced technology nodes Internships | imec | Leuven |
| 141 | [NanoIC] Design-Technology Co-Optimization for embedded and heterogeneously integrated devices in future semiconductor systems Internships | imec | Leuven |
| 142 | [NanoIC] Inline metrology with Atomic Force Microscopy: from homogeneous smooth surfaces to high-aspect-ratio multi-material devices Internships | imec | Leuven |
| 143 | [NanoIC] Metrology and Defectivity Study in 3D Patterning Processes Internships | imec | Leuven |
| 144 | [NanoIC] Reliability characterization of CMOS 2.0 nodes using low-frequency noise Internships | imec | Leuven |
| 145 | [NanoIC] Reliability of semiconducting oxides: the last roadblock for memory applications Internships | imec | Leuven |
| 146 | [NanoIC] Revealing Yet-Unknown Manufacturing Defects in Advanced Semiconductor Technologies Internships | imec | Leuven |
| 147 | [NanoIC] Revealing the Structure-Composition Role on Ultrafast Carrier Dynamics in Advanced Logic and Memory Devices Internships | imec | Leuven |
| 148 | 2D nanocrystals as water-tight ionic membranes for low-temperature CO2 electrolysis Internships | imec | Leuven |
| 149 | 3D Object Shape Characterization Using Integrated Sensing and Communication (ISAC) Network Internships | imec | Leuven |
| 150 | AI-Driven Process Optimization for TEM Automation Internships | imec | Leuven |
| 151 | ALD TiO2 Passivation of Sb2S3 Photocathodes for Photoelectrochemical Hydrogen Production Internships | imec | Genk |
| 152 | Admittance modeling for scoping defects in advanced germanium Metal-Oxide-Semiconductor gate stacks for CFET Internships | imec | Leuven |
| 153 | Advanced (multi-wire) interconnection and lamination technologies for integrated PV Internships | imec | Genk |
| 154 | Advanced Characterization of Hafnium-Based Ferroelectric Capacitors to Reveal Interdependencies Among Critical Reliability Phenomena Internships | imec | Leuven |
| 155 | Advanced material analysis - nuclear reaction analysis (NRA) depth profiling at the Van de Graaff accelerator through automating the voltage control with LabView. Internships | imec | Leuven |
| 156 | Advancing Cardiotoxicity Testing with Electrical Pacing and CMOS Biosensing Internships | imec | Leuven |
| 157 | Analog Integrated Circuit Design for Photonic Drift Compensation Internships | imec | Leuven |
| 158 | Analog Integrated Circuit Design for Photonic Drift Compensation Internships | imec | Leuven |
| 159 | Application-Driven Memory xTCO Internships | imec | Leuven |
| 160 | Atomic modelling of bond strength for dielectric breakdown predictions Internships | imec | Leuven |